INTEGRATION OF ACTIVE THIN FILMS WITH SILICON COMPATIBLE MATERIALS AND PROCESS SCIENCE PROTOCOLS FOR MEMS SCALE VIBRATION DAMPING APPLICATIONS
COLE, M. W., NOTHWANG, W. D., HIRSCH, S., MOHANCHANDRA, K. P., DEMAREE, J. D., CARMAN, G. P.Volume:
71
Language:
english
Journal:
Integrated Ferroelectrics
DOI:
10.1080/10584580590964718
Date:
July, 2005
File:
PDF, 3.69 MB
english, 2005