[IEEE 2007 8th International Conference on Electronic...

  • Main
  • [IEEE 2007 8th International Conference...

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints

Jong, Wen-Ren, Tsai, Hsin-Chun, Huang, Ching-Tzu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/icept.2007.4441502
File:
PDF, 996 KB
english, 2007
Conversion to is in progress
Conversion to is failed