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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints
Jong, Wen-Ren, Tsai, Hsin-Chun, Huang, Ching-TzuYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441502
File:
PDF, 996 KB
english, 2007