![](/img/cover-not-exists.png)
Nondestructive Testing and Quality Control of the LHC Main Interconnection Splices
Heck, S., Solfaroli, M., Andreassen, O., Thonet, P., Scheuerlein, C., Ballarino, A., Bertinelli, F., Bottura, L., Fessia, P., Tock, J.-Ph.Volume:
25
Language:
english
Journal:
IEEE Transactions on Applied Superconductivity
DOI:
10.1109/TASC.2014.2363056
Date:
April, 2015
File:
PDF, 1.43 MB
english, 2015