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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Mold flow analysis of molding process for a MEMS fingerprint sensor package
Li, Guoxing, Yang, Daoguo, Li, Ruifeng, Cai, Miao, Li, Chao, Wang, LingenYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922946
File:
PDF, 735 KB
english, 2014