[IEEE 2008 58th Electronic Components and Technology...

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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Carbon nanotube bumps for LSI interconnect

Ikuo Soga,, Daiyu Kondo,, Yoshitaka Yamaguchi,, Taisuke Iwai,, Masataka Mizukoshi,, Yuji Awano,, Kunio Yube,, Takashi Fujii,
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Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550158
File:
PDF, 1.15 MB
english, 2008
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