[IEEE 2009 11th Electronics Packaging Technology Conference...

  • Main
  • [IEEE 2009 11th Electronics Packaging...

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Ultra thinning of wafer for embedded wafer packaging

Vincent, Lee Wen Sheng, Navas Khan, Johnson Kek, Chua, H S, Tsutsumi, Yoshihiro, Yew, L C, Wee, Ho Soon, Eipa, Myo, Vempati, Srinivas, Kripesh, V., Sundaram, Venky
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416415
File:
PDF, 2.77 MB
english, 2009
Conversion to is in progress
Conversion to is failed