[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology
Karioja, Pentti, Kautio, Kari, Ollila, Jyrki, Keranen, Kimmo, Karppinen, Mikko, Heikkinen, Veli, Jaakola, Tuomo, Lahti, MarkkuYear:
2014
Language:
english
DOI:
10.1109/ESTC.2014.6962731
File:
PDF, 1.20 MB
english, 2014