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Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method
Hwang, Hui Yun, Kim, Byung Jung, Chin, Woo Seok, Kim, Hak Sung, Lee, Dai GilVolume:
19
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856105774382453
Date:
January, 2005
File:
PDF, 1.35 MB
english, 2005