Compact failure modeling for devices subject to...

Microelectronics Reliability 2015 / 01 Vol. 55; Iss. 1

Compact failure modeling for devices subject to electrostatic discharge stresses – A review pertinent to CMOS reliability simulation

Miao, Meng, Zhou, Yuanzhong, Salcedo, Javier A., Hajjar, Jean-Jacques, Liou, Juin J.
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Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.10.015
Date:
January, 2015
File:
PDF, 1.65 MB
english, 2015
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