[IEEE 2006 IEEE International Reliability Physics Symposium Proceedings - San Jose, CA, USA (2006.03.26-2006.03.30)] 2006 IEEE International Reliability Physics Symposium Proceedings - Study of Cu Migration-Induced Failure of Inter-Layer Dielectric
Hwang, Sang-soo, Jung, Sung-yup, Jung, Jung-kyu, Joo, Young-changYear:
2006
Language:
english
DOI:
10.1109/relphy.2006.251318
File:
PDF, 166 KB
english, 2006