Chemical effects on the tribological behavior during copper...

Materials Chemistry and Physics 2015 / 03 Vol. 153

Chemical effects on the tribological behavior during copper chemical mechanical planarization

Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun
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Volume:
153
Language:
english
Journal:
Materials Chemistry and Physics
DOI:
10.1016/j.matchemphys.2014.12.033
Date:
March, 2015
File:
PDF, 1.40 MB
english, 2015
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