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A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
Juan Gomez, Cemal BasaranVolume:
42
Year:
2005
Language:
english
Pages:
29
DOI:
10.1016/j.ijsolstr.2004.11.022
File:
PDF, 519 KB
english, 2005