[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation
Pak, Jiwoo, Ha, Myunghyun, Kim, Jaemin, Kang, Donghee, Choi, Ho, Kwon, Seyoung, La, Keunsoo, Kim, JounghoYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763625
File:
PDF, 6.05 MB
english, 2008