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[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - Fabrication of TSV-based silicon interposers
Malta, D., Vick, E., Goodwin, S., Gregory, C., Lueck, M., Huffman, A., Temple, D.Year:
2010
Language:
english
DOI:
10.1109/3dic.2010.5751443
File:
PDF, 837 KB
english, 2010