Development of cost-effective high-density through-wafer...

Journal of Micromechanics and Microengineering 2006 / 06 Vol. 16; Iss. 6

Development of cost-effective high-density through-wafer interconnects for 3D microsystems

Lietaer, Nicolas, Storås, Preben, Breivik, Lars, Moe, Sigurd
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Volume:
16
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/16/6/s06
Date:
June, 2006
File:
PDF, 832 KB
english, 2006
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