Evaluation of Thermal and Hygro-Thermal Behaviors of Flip...

Journal of Adhesion Science and Technology 2008 / 01 Vol. 22; Iss. 13

Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste

Noh, Bo-In, Lee, Jong-Bum, Kim, Jong-Woong, Jung, Seung-Boo
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Volume:
22
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108X309512
Date:
January, 2008
File:
PDF, 2.89 MB
english, 2008
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