Effect of copper content on the electrical stability of nickel oxide films
Chen, S.C., Kuo, T.Y., Jen, S.U., Chiang, H.P., Liu, W.Y., Wang, C.H.Volume:
584
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2014.11.085
Date:
June, 2015
File:
PDF, 1.32 MB
english, 2015