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Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics
Siau, Sam, Vervaet, Alfons, Van Vaeck, Luc, Schacht, Etienne, Demeter, Ulric, Van Calster, AndreVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1904911
File:
PDF, 1.06 MB
english, 2005