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A new partial transient liquid-phase bonding process with powder-mixture interlayer for bonding Cf/SiC composite and Ti–6Al–4V alloy
Wang, Wanli, Fan, Dongyu, Huang, Jihua, Cui, Bing, Chen, Shuhai, Zhao, XingkeVolume:
143
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2014.12.110
Date:
March, 2015
File:
PDF, 1.09 MB
english, 2015