An efficient and simple compact modeling approach for 3-D...

Microelectronics Journal 2015 / 02 Vol. 46; Iss. 2

An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration

Lorival, Jean-Etienne, Calmon, Francis, Sun, Fengyuan, Frantz, Felipe, Plossu, Carole, Le Berre, Martine, O’Connor, Ian, Valorge, Olivier, Charbonnier, Jean, Henry, David, Gontrand, Christian
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Volume:
46
Language:
english
Journal:
Microelectronics Journal
DOI:
10.1016/j.mejo.2014.12.002
Date:
February, 2015
File:
PDF, 5.75 MB
english, 2015
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