EIS and statistical analysis of copper electrodeposition...

Journal of Electroanalytical Chemistry 2006 Vol. 594; Iss. 2

EIS and statistical analysis of copper electrodeposition accounting for multi-component transport and reactions

M.E. Huerta Garrido, M.D. Pritzker
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Volume:
594
Year:
2006
Language:
english
Pages:
15
DOI:
10.1016/j.jelechem.2006.05.026
File:
PDF, 432 KB
english, 2006
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