Cu nanofilm formation by electrochemical atomic layer...

Journal of Electroanalytical Chemistry 2008 Vol. 621; Iss. 2

Cu nanofilm formation by electrochemical atomic layer deposition (ALD) in the presence of chloride ions

Jay Yu Kim, Youn-Geun Kim, John L. Stickney
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Volume:
621
Year:
2008
Language:
english
Pages:
9
DOI:
10.1016/j.jelechem.2007.10.005
File:
PDF, 1.27 MB
english, 2008
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