Electrodeposition of submicron/nanoscale Cu2O/Cu junctions...

Journal of Electroanalytical Chemistry 2010 Vol. 638; Iss. 2

Electrodeposition of submicron/nanoscale Cu2O/Cu junctions in an ultrathin CuSO4 solution layer

Guangwei Yu, Xiaobo Hu, Duo Liu, Daliang Sun, Jing Li, Huaijin Zhang, Hong Liu, Jiyang Wang
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Volume:
638
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.jelechem.2009.11.004
File:
PDF, 609 KB
english, 2010
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