The Electrical Specific Action to Melt of Structural Copper...

IEEE Transactions on Plasma Science 2014 / 10 Vol. 42; Iss. 10

The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys

Vanderburg, Andrew, Stefani, Francis, Sitzman, Alex, Crawford, Mark, Surls, Dwayne, Ling, Chloe, McDonald, Jason
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Volume:
42
Language:
english
Journal:
IEEE Transactions on Plasma Science
DOI:
10.1109/tps.2014.2313292
Date:
October, 2014
File:
PDF, 1.55 MB
english, 2014
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