Electrochemically Deposited Ruthenium Seed Layer Followed by Copper Electrochemical Plating
Kim, Young-Soon, Kim, Hyung-Il, Dar, M. A., Seo, Hyung-Kee, Kim, Gil-Sung, Ansari, S. G., Senkevich, Jay J., Shin, Hyung-ShikVolume:
9
Year:
2006
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2138444
File:
PDF, 843 KB
english, 2006