Curved in-plane electromechanical relay for low power logic...

Journal of Micromechanics and Microengineering 2013 / 02 Vol. 23; Iss. 2

Curved in-plane electromechanical relay for low power logic applications

Grogg, Daniel, Drechsler, Ute, Knoll, Armin, Duerig, Urs, Pu, Yu, Hagleitner, Christoph, Despont, Michel
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Volume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/2/025024
Date:
February, 2013
File:
PDF, 1.52 MB
english, 2013
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