Development of a process modeling for residual stress assessment of multilayer thin film structure
Wang, H.J., Deng, H.A., Chiang, S.Y., Su, Y.F., Chiang, K.N.Volume:
584
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2015.01.014
Date:
June, 2015
File:
PDF, 1.80 MB
english, 2015