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Thermal characteristics for chip on metal package of LED lighting module
Maeng, Seung-Ryol, Ko, Seok-CheolVolume:
38
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2014.11.025
Date:
October, 2015
File:
PDF, 2.22 MB
english, 2015