Thermal characteristics for chip on metal package of LED...

Materials Science in Semiconductor Processing 2015 / 10 Vol. 38

Thermal characteristics for chip on metal package of LED lighting module

Maeng, Seung-Ryol, Ko, Seok-Cheol
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Volume:
38
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2014.11.025
Date:
October, 2015
File:
PDF, 2.22 MB
english, 2015
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