Mechanical and Microstructural Characterization of Through-Silicon Via Fabricated with Constant Current Pulse-Reverse Modulation
Lin, Nay, Miao, Jianmin, Dixit, PradeepVolume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3368707
File:
PDF, 857 KB
english, 2010