Electron backscatter diffraction characterization of...

Thin Solid Films 2015 / 06 Vol. 584

Electron backscatter diffraction characterization of electrolytic Cu deposition in the blind-hole structure: Current density effect

Ho, C.E., Chen, C.C., Hsu, L.H., Lu, M.K.
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Volume:
584
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2014.12.042
Date:
June, 2015
File:
PDF, 2.57 MB
english, 2015
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