RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING...

International Journal of Modern Physics B 2006 / 10 Vol. 20; Iss. 25n27

RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING ACCELERATED LIFE TEST

LEE, OUK SUB, MYOUNG, NO HOON, KIM, DONG HYEOK, HUR, MAN JAE, HWANG, SI WOON
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Volume:
20
Language:
english
Journal:
International Journal of Modern Physics B
DOI:
10.1142/S0217979206041677
Date:
October, 2006
File:
PDF, 345 KB
english, 2006
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