Design Considerations for Patterned Wafer Bonding
Cha, Giho, Lee, Byoung H., Lee, Kyung W., Bae, Gum J., Kim, Wan D., Lee, Jun H., Kim, Il K., Park, Kyu C., Lee, Sang I., Koh, Young B.Volume:
36
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.36.1912
Date:
March, 1997
File:
PDF, 2.16 MB
1997