![](/img/cover-not-exists.png)
[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Greenwich, London, United Kingdom (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis
Elger, Gordon, Kandaswamy, Shri Vishnu, Derix, Robert, Conti, FoscaYear:
2014
Language:
english
DOI:
10.1109/therminic.2014.6972530
File:
PDF, 1.39 MB
english, 2014