Stacked Packaging Laminar-Convection-Cooled Printed Circuit...

Journal of Thermophysics and Heat Transfer 2008 / 04 Vol. 22; Iss. 2

Stacked Packaging Laminar-Convection-Cooled Printed Circuit Using the Entropy Generation Minimization Method

Torii, Shuichi, Furukawa, Takahiro, Yang, Wen-Jei
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Volume:
22
Language:
english
Journal:
Journal of Thermophysics and Heat Transfer
DOI:
10.2514/1.30451
Date:
April, 2008
File:
PDF, 473 KB
english, 2008
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