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Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect
Koo, Hyo-Chol, Saha, Rajarshi, Kohl, Paul A.Volume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.066112jes
File:
PDF, 439 KB
english, 2011