Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper
Josell, D., Kim, Sibum, Wheeler, D., Moffat, T. P., Pyo, Sung GyuVolume:
150
Year:
2003
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1566960
File:
PDF, 420 KB
english, 2003