Thermal analysis for indirect liquid cooled multichip...

Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology

Yingjun Cheng,, Gaowei Xu,, Dapeng Zhu,, Wenjie Zhu,, Luo, L.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848589
Date:
March, 2006
File:
PDF, 1.12 MB
english, 2006
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