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Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology
Yingjun Cheng,, Gaowei Xu,, Dapeng Zhu,, Wenjie Zhu,, Luo, L.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848589
Date:
March, 2006
File:
PDF, 1.12 MB
english, 2006