Vertical System Integration by Using Inter-Chip Vias and...

Japanese Journal of Applied Physics 2004 / 6 Vol. 43; Iss. No. 7A

Vertical System Integration by Using Inter-Chip Vias and Solid-Liquid Interdiffusion Bonding

Klumpp, Armin, Merkel, Reinhard, Ramm, Peter, Weber, Josef, Wieland, Robert
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
43
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.43.l829
Date:
June, 2004
File:
PDF, 185 KB
english, 2004
Conversion to is in progress
Conversion to is failed