Failure mechanisms and assembly-process-based solution of...

Journal of Semiconductors 2012 / 05 Vol. 33; Iss. 5

Failure mechanisms and assembly-process-based solution of FCBGA high lead C4 bump non-wetting

Li, Wenqi, Qiu, Yiming, Jin, Xing, Wang, Lei, Wu, Qidi
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Volume:
33
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/33/5/056001
Date:
May, 2012
File:
PDF, 886 KB
english, 2012
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