Deformation analysis of Au wire bonding

Journal of Materials Processing Technology 2006 Vol. 177; Iss. 1-3

Deformation analysis of Au wire bonding

Hiroyuki Saiki, Yasuo Marumo, Hiroshi Nishitake, Tetsuhiro Uemura, Takahiro Yotsumoto
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Volume:
177
Year:
2006
Language:
english
Pages:
4
DOI:
10.1016/j.jmatprotec.2006.04.024
File:
PDF, 302 KB
english, 2006
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