Evolution of the bond interface during ultrasonic Al–Si...

Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process

Hongjun Ji, Mingyu Li, Chunqing Wang, Jingwei Guan, Han Sur Bang
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Volume:
182
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.jmatprotec.2006.07.033
File:
PDF, 1.09 MB
english, 2007
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