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Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process
Hongjun Ji, Mingyu Li, Chunqing Wang, Jingwei Guan, Han Sur BangVolume:
182
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.jmatprotec.2006.07.033
File:
PDF, 1.09 MB
english, 2007