Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers
Ji-hua Huang, Yue-ling Dong, Yun Wan, Xing-ke Zhao, Hua ZhangVolume:
190
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.jmatprotec.2007.02.028
File:
PDF, 1.12 MB
english, 2007