Retarding the Cu–Sn and Ag–Sn intermetallic compounds by...

Journal of Materials Science: Materials in Electronics 2015 / 4 Vol. 26; Iss. 4

Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies

Chen, Wei-Yu, Chou, Tzu-Ting, Tu, Wei, Chang, Hsiang-Ching, Lee, Christine Jill, Duh, Jenq-Gong
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Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2691-2
Date:
April, 2015
File:
PDF, 1.05 MB
english, 2015
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