Pad roughness variation and its effect on material removal...

Journal of Materials Processing Technology 2008 Vol. 203; Iss. 1-3

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong
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Volume:
203
Year:
2008
Language:
english
Pages:
6
DOI:
10.1016/j.jmatprotec.2007.10.033
File:
PDF, 989 KB
english, 2008
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