Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy
Juan-hua Su, Ping Liu, Qi-ming Dong, He-jun Li, Feng-zhang RenVolume:
205
Year:
2008
Language:
english
Pages:
4
DOI:
10.1016/j.jmatprotec.2007.11.184
File:
PDF, 589 KB
english, 2008