![](/img/cover-not-exists.png)
Correlation between break-in characteristics and pad surface conditions in silicon wafer polishing
Kihyun Park, Jaehong Park, Boumyoung Park, Haedo JeongVolume:
205
Year:
2008
Language:
english
Pages:
6
DOI:
10.1016/j.jmatprotec.2007.11.203
File:
PDF, 860 KB
english, 2008