Correlation between break-in characteristics and pad...

Correlation between break-in characteristics and pad surface conditions in silicon wafer polishing

Kihyun Park, Jaehong Park, Boumyoung Park, Haedo Jeong
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Volume:
205
Year:
2008
Language:
english
Pages:
6
DOI:
10.1016/j.jmatprotec.2007.11.203
File:
PDF, 860 KB
english, 2008
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