Investigation of ultrasonic copper wire wedge bonding on...

Journal of Materials Processing Technology 2008 Vol. 208; Iss. 1-3

Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature

Yanhong Tian, Chunqing Wang, Ivan Lum, M. Mayer, J.P. Jung, Y. Zhou
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Volume:
208
Year:
2008
Language:
english
Pages:
8
DOI:
10.1016/j.jmatprotec.2007.12.134
File:
PDF, 1.40 MB
english, 2008
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