Computer simulation of solder paste flow Part I: Dense...

Journal of Electronics Manufacturing 1994 / 09 Vol. 4; Iss. 3

Computer simulation of solder paste flow Part I: Dense suspension theory

MANNAN, S.H., EKERE, N.N., ISMAIL, I., CURRIE, M.A.
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Volume:
4
Language:
english
Journal:
Journal of Electronics Manufacturing
DOI:
10.1142/S0960313194000158
Date:
September, 1994
File:
PDF, 530 KB
english, 1994
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