Optimization of a reflow soldering process based on the heating factor
Gao, JinGang, Wu, YiPing, Ding, HanVolume:
19
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910710748131
Date:
February, 2007
File:
PDF, 293 KB
english, 2007