[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Designing A 3D printing based channel emulator
Jiao, Xiangyang, He, Hui, Li, Guanghua, Qian, Wei, Shen, Guangyao, Pommerenke, David, Ding, Chong, White, Douglas, Scearce, Stephen, Yang, YaochaoYear:
2014
Language:
english
DOI:
10.1109/ISEMC.2014.6899106
File:
PDF, 1.08 MB
english, 2014